HyperLight Introduces 400G-per-lane PICs on its TFLN ChipletTM Platform for Next-Generation AI Interconnects
CAMBRIDGE, Mass.--(BUSINESS WIRE)-- #400GperLane--HyperLight Corporation (“HyperLight”), creator of the TFLN ChipletTM Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energy-efficient and high-performance 400G-per-lane optical links. The transition







